Publikationsliste

2023

  • S. Stock, L. Mirau, M. Rutsch, S. Wismath, M. Kupnik, R. von Klitzing, A. Rahimzadeh, „Ultrasound-Induced Adsorption of Acousto-Responsive Microgels at Water-Oil Interface“, Advanced Science, 2023. DOI: 10.1002/advs.202305395.
  • Y. Sellami, O.B. Dali, R. Chadda, S. Zhukov, M. Guermazi, A.A. Altmann, H. von Seggern, B. Latsch, N. Schäfer, M. Kupnik, „Piezoelectret sensors from direct 3D-printing onto bulk films“, IEEE SENSORS, IEEE, 2023. DOI: 10.1109/SENSORS56945.2023.10324862.
  • Y. Schrödel, C. Hartmann, T. Lang, J.A. Zheng, M. Steudel, M. Rutsch, S.H. Salman, M. Kellert, M. Pergament, T. Hahn-Hose, S. Suppelt, J.H. Dörsam, A. Harth, W. P. Leemans, F. X. Kärtner, I. Hartl, M. Kupnik, C. M. Heyl, „Gigawatt-Scale Acousto-Optic Modulation in Ambient Air“, The European Conference on Lasers and Electro-Optics. Optica Publishing Group, 2023. DOI: 10.1109/CLEO/EUROPE-EQEC57999.2023.10231608.
  • B. Latsch, O.B. Dali, R. Chadda, N. Schäfer, A.A. Altmann, M. Grimmer, P. Beckerle, M. Kupnik, „Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration“, IEEE SENSORS, IEEE, 2023. DOI: 10.1109/SENSORS56945.2023.10325114.
  • S. Köble, J.H. Dörsam, C. Haugwitz, A.A. Altmann, G. Allevato, A. Melnikov, S. G. Koch, M. Kupnik, „Scaling of Air-Coupled Metagratings for Beam Steering“, IEEE International Ultrasonics Symposium (IUS), IEEE, 2023. DOI: 10.1109/IUS51837.2023.10307367.
  • R. Chadda, O.B. Dali, B. Latsch, E. Sundaralingam, M. Kupnik, „3D-Printed Strain Gauges Based on Conductive Filament for Experimental Stress Analysis“, IEEE SENSORS, IEEE, 2023. DOI: 10.1109/sensors56945.2023.10325276.
  • C. Haugwitz, T. Hahn-Jose, G. Allevato, J. Hinrichs, J. H. Dörsam, A. Kühn, S. Steineck, J. Lange, M. Kupnik, „Detection of Air-Voids in Foam-filled Sandwich Panels using Air-Coupled Lamb Waves“, IEEE International Ultrasonics Symposium (IUS), IEEE, 2023. DOI: 10.1109/IUS51837.2023.10307250.
  • K. Schäfer, M. Lutzi, M. B. Khan, L. Schäfer, K. Skokov, I. Dirba, S. Bruns, I. Valizadeh, O. Weeger, C. Hartmann, M. Kupnik, E. Adabifiroozjaei, L. Molina-Luna, O. Gutfleisch, „Local stiffness tailoring of magneto-active composites produced by laser powder bed fusion“, arXiv preprint arXiv:2305.02643, 2023. DOI: 10.48550/arXiv.2305.02643.
  • X. Yang, X. Ma, C. Ding, G. M. Sessler, H. von Seggern, M. Kupnik, Y. Dai, P. He, X. Zhang, „Resilient electret film-based vibrational energy harvesters with a V-shaped counter electrode“, IET Nanodielectrics, 2023. DOI: 10.1049/nde2.12040.
  • F. Merbeler, C. Bretthauer, M. Kupnik, „Ultrasound Fill-Level and Touch Sensors Through Acoustic Coupling for CMUTs“, IEEE Sensors Journal, 2023. DOI: 10.1109/JSEN.2023.3286929.
  • A Kühn, C Haugwitz, J Hinrichs, M Kupnik, J Lange, „Investigating the impact of thermal stresses on blistering effects in sandwich panels“, ce/papers, 2023. DOI: 10.1002/cepa.2311.
  • Y. Schrödel, C. Hartmann, J. Zheng, T. Lang, M. Steudel, M. Rutsch, S. H. Salman, M. Kellert, M. Pergament, T. Hahn-Jose, S. Suppelt, J. H. Dörsam, A. Harth, W. P. Leemans, F. X. Kärtner, I. Hartl, M. Kupnik and C. M. Heyl, „Acousto-optic modulation of gigawatt-scale laser pulses in ambient air“, Nature Photonics, 2023. DOI: 10.1038/s41566-023-01304-y.
  • X. Xiang, X. Ma, L. Zhou, G. M. Sessler, H. v. Seggern, O. Ben Dali, M. Kupnik, P. He, Y. Dai and X. Zhang,„Threadlike Piezoelectric Sensors Based on Ferroelectrets and Their Application in Washable and Breathable Smart Clothing“, Advanced Materials Technologies, S.2202130, 2023. DOI: 10.1002/admt.202202130.
  • X. Ma, S. Zhukov, H. v. Seggern, G. M. Sessler, O. Ben Dali, Y. Dai, P. He, X. Zhang and M. Kupnik, “Biodegradable and Bioabsorbable Polylactic Acid Ferroelectrets with Prominent Piezoelectric Activity”, Advanced Electronic Materials, S. 2201070, 2023. DOI: 10.1002/aelm.202201070.

2022

  • O. Ben Dali, S. Zhukov, R. Chadda, A. Kasanski, H. v. Seggern, X. Zhang, G. M. Sessler and M. Kupnik, “Eco-Friendly High Sensitive Piezoelectrets for Force Myography”, IEEE Sensors Journal, 2022. DOI: 10.1109/JSEN.2022.3225723.
  • F. Herbst, R. Chadda, C. Hartmann, J. Peters, D. Riehl, T. Gwosch, K. Hofmann, S. Matthiesen and M. Kupnik, “Multi-axis Force Sensor for Sensor-integrating Bolts”, IEEE Sensors, S. 1-4., IEEE, 2022. DOI: 10.1109/SENSORS52175.2022.9967220.
  • S. Suppelt, R. Chadda, T. Büchner, N. Schäfer, R. Sader and M. Kupnik, “Measurement System for Human Lateral Mandibular Forces”, IEEE Sensors, S. 1-4., IEEE, 2022. DOI: 10.1109/SENSORS52175.2022.9967072.
  • S. Schulte, G. Allevato, C. Haugwitz and M. Kupnik, “Deep-Learned Air-Coupled Ultrasonic Sonar Image Enhancement and Object Localization”, IEEE Sensors, S. 01-04., IEEE, 2022. DOI: 10.1109/SENSORS52175.2022.9967244.
  • O. Ben Dali, Y. Sellami, S. Zhukov, H. v. Seggern, N. Schäfer, B. Latsch, G. M. Sessler, P. Beckerle and M. Kupnik, “Ultrasensitive and low-cost insole for gait analysis using piezoelectrets” IEEE Sensors, S. 1-4., IEEE, 2022. DOI: 10.1109/SENSORS52175.2022.9967198.
  • M. Rutsch, O. Ben Dali, P. Downing, G. Allevato, C. Haugwitz, J. Hinrichs and M. Kupnik, “Optimization of thin film protection for waveguided ultrasonic phased arrays”, IEEE International Ultrasonics Symposium (IUS), S. 1-4., IEEE, 2022. DOI: 10.1109/IUS54386.2022.9957324.
  • J. Hinrichs, C. Haugwitz, M. Rutsch, G. Allevato, J. H. Dörsam and M. Kupnik, “Simulation of Lamb Waves Excited by an Air-Coupled Ultrasonic Phased Array for Non-Destructive Testing”, IEEE International Ultrasonics Symposium (IUS), S. 1-4., IEEE, 2022. DOI: 10.1109/IUS54386.2022.9957266.
  • F. Merbeler, Fabian, S. Wismath, M. Haubold, C. Bretthauer and M. Kupnik, “Ultra-Low-Voltage High-Efficiency CMUTs with Piston-Structured Plates for Fill Level Sensing”, IEEE International Ultrasonics Symposium (IUS), S. 1-4., IEEE, 2022. DOI: 10.1109/IUS54386.2022.9957501.
  • G. Allevato, T. Frey, C. Haugwitz, M. Rutsch, J. Hinrichs, R. Müller, Marius Pesavento and M. Kupnik, “Calibration of Air-Coupled Ultrasonic Phased Arrays. Is it worth it?”, IEEE International Ultrasonics Symposium (IUS), S. 1-4., IEEE, 2022. DOI: 10.1109/IUS54386.2022.9957576.
  • I. O. Wygant and M. Kupnik, “An Equivalent Circuit Model of PMUTs with Clamped and Simply-Supported Plates”, IEEE International Ultrasonics Symposium (IUS), S. 1-4., IEEE, 2022. DOI: 10.1109/IUS54386.2022.9958745.
  • M. Rutsch, G. Allevato, J. Hinrichs, C. Haugwitz, R. Augenstein, T. Kaindl and M. Kupnik, “A Compact acoustic waveguide for air-coupled ultrasonic phased arrays at 40 kHz”, IEEE International Ultrasonics Symposium (IUS), S. 1-4., IEEE, 2022. DOI: 10.1109/IUS54386.2022.9958381.
  • M. Rutsch, L. Schultz-Fademrecht, G. Allevato, C. Haugwitz, J. Hinrichs and M. Kupnik, “Simulation of acoustic losses in waveguides for air-coupled ultrasonic phased arrays”, IEEE International Ultrasonics Symposium (IUS), S. 1-4., IEEE, 2022. DOI: 10.1109/IUS54386.2022.9958656.
  • C. Haugwitz, J. Hinrichs, M. Rutsch, G. Allevato, J. H. Dörsam and M. Kupnik, “Lamb Wave Reflection and Transmission in Bent Steel Sheets at Low Frequency”, IEEE International Ultrasonics Symposium (IUS), S. 1-4., IEEE, 2022. DOI: 10.1109/IUS54386.2022.9958055.
  • A. Razavi, M. Rutsch, S. Wismath, R. von Klitzing, A. Rahimzadeh and M. Kupnik, „Frequency-Dependent Ultrasonic Stimulation of Poly (N-isopropylacrylamide) Microgels in Water“, Gels, 8. Jg., Nr. 10, S. 628, 2022. DOI: 10.3390/gels8100628.
  • R. Chadda, M. Link, C. Hartmann, O. Ben Dali, J. Probst, H. Merschroth, E. Abele, M. Weigold and M. Kupnik, „Evaluation of Additively Manufactured Parts in Disruptive Manner as Deformation Elements for Structural Integrated Force Sensors“, IEEE Sensors Journal, 2022. DOI: 10.1109/JSEN.2022.3205172.
  • F. Merbeler, S. Wismath, M. Haubold, C. Bretthauer and M. Kupnik, „Ultra-Low-Voltage Capacitive Micromachined Ultrasonic Transducers with Increased Output Pressure Due to Piston-Structured Plates“, Micromachines, 13. Jg., Nr. 5, S. 676., 2022. DOI: 10.3390/mi13050676
  • O. Ben Dali, H. von Seggern, G. Sessler, P. Pondrom, S. Zhukov, X. Zhang und M. Kupnik „Ferroelectret energy harvesting with 3D‐printed air‐spaced cantilever design“, Nano Select, 3. Jg., Nr. 3, S. 713-722, 2022. DOI: 10.1002/nano.202100210.
  • G. Allevato, M. Rutsch, J. Hinrichs, C. Haugwitz, R. Müller, M. Pesavento and M. Kupnik „Air-Coupled Ultrasonic Spiral Phased Array for High-Precision Beamforming and Imaging“ in Journal of Ultrasonics, Ferroelectrics, and Frequency Control, 2. Jg., S. 40-54, IEEE, 2022. DOI: 10.1109/OJUFFC.2022.3142710.
  • C. Haugwitz, C. Hartmann, G. Allevato, M. Rutsch, J. Hinrichs, J. Brötz, D. Bothe, Peter F. Pelz and M. Kupnik „Multipath Flow Metering of High-Velocity Gas using Ultrasonic Phased-Arrays“ in Journal of Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Open 2022. DOI: 10.1109/OJUFFC.2022.3141333.

2021

  • T. Maier, G. Allevato, M. Rutsch and M. Kupnik, „Single Microcontroller Air-coupled Waveguided Ultrasonic Sonar System,“ in Proc. IEEE Sensors, pp. 1-4, 2021. DOI: 10.1109/SENSORS47087.2021.9639849.
  • S. Suppelt, R. Chadda, N. Schäfer, R. Sader and M. Kupnik, „Sensor for Bilateral Human Bite Force Measurements,“ in Proc. IEEE Sensors, pp. 1-4, 2021. DOI: 10.1109/SENSORS47087.2021.9639818.
  • M. Rutsch, A. Unger, G. Allevato, J. Hinrichs, A. Jäger, T. Kaindl and Mario Kupnik „Waveguide for air-coupled ultrasonic phased-arrays with propagation time compensation and plug-in assembly“ in Journal of the Acoustical Society of America, 150. Jg., Nr. 5, S. 3228-3237, 2021. DOI: 10.1121/10.0006969 .
  • J. Hinrichs, M. Sachsenweger, M. Rutsch, G. Allevato, W. M. D. Wright, M. Kupnik „Lamb waves excited by an air-coupled ultrasonic phased array for non-contact, non-destructive detection of discontinuities in sheet materials“ International Ultrasonics Symposium (IUS), S. 1-4, IEEE, 2021. DOI: 10.1109/IUS52206.2021.9593363.
  • M. Rutsch, F. Krauß, G. Allevato, J. Hinrichs, C. Hartmann, M. Kupnik „Simulation of protection layers for air-coupled waveguided ultrasonic phased-arrays“ International Ultrasonics Symposium (IUS)., S. 1-4, IEEE, 2021. DOI: 10.1109/IUS52206.2021.9593561.
  • O. Ben Dali, S. Zhukov, M. Rutsch, C. Hartmann, H. Von Seggern, G. M. Sessler, M. Kupnik „Biodegradable 3D-printed ferroelectret ultrasonic transducer with large output pressure“ International Ultrasonics Symposium (IUS), S. 1-4, IEEE, 2021. DOI: 10.1109/IUS52206.2021.9593738.
  • C. Hartmann, C. Haugwitz, G. Allevato, M. Rutsch, J. Hinrichs, J. Brötz, D. Bothe, P. Pelz an M. Kupnik „Ray-tracing simulation of sound drift effect for multi-path ultrasonic high-velocity gas flow metering“ International Ultrasonics Symposium (IUS), S. 1-4, IEEE, 2021. DOI: 10.1109/IUS52206.2021.9593898.
  • T. Kaindl, R. Augenstein, A. Jaeger, M. Rutsch and M. Kupnik „1d ultrasonic converter unit“ U.S. Patent Application Nr. 17/148,418, 2021.
  • H. von Seggern, S. Zhukov, O. Ben Dali, C. Hartmann. G. M. Sessler and M. Kupnik „Highly Efficient Piezoelectrets through Ultra-Soft Elastomeric Spacers“. Polymers, 13. Jg., Nr. 21, S. 3751, 2021. DOI: 10.3390/polym13213751.
  • A. Rahimzadeh, M. Rutsch, M. Kupnik, and R. von Klitzing „Visualization of Acoustic Energy Absorption in Confined Aqueous Solutions by PNIPAM Microgels: Effects of Bulk Viscosity“ Langmuir, 37. Jg., Nr. 19, S. 5854-5863, 2021. DOI: 10.1021/acs.langmuir.1c00235.
  • O. Ben Dali, H. von Seggern, G. Sessler, P. Pondrom, S. Zhukov, X. Zhang, M. Kupnik, „Ferroelectret energy harvesting with 3D‐printed air‐spaced cantilever design“. Nano Select, 2021.

2020

  • D. Gür, N. Schäfer, P. Beckerle and M. Kupnik, “A Human-Computer Interface Replacing Mouse and Keyboard for Individuals with Limited Upper Limb Mobility”, in Journal on Multimodal Technologies and Interaction, vol. 4/84, pp. 1–16, 2020. DOI: 10.3390/mti4040084.
  • X. Ma, H. von Seggern, G. Sessler, S. Zhukov, O. Ben Dali, M. Kupnik, and X. Zhang, “High performance fluorinated polyethylene propylene ferroelectrets with an air-filled parallel-tunnel structure”, to appear in IOP Journal Smart Materials and Structures, pp. 1–16, 2020. DOI: 10.1088/1361-665X/abc525.
  • Y. Xue, X. Zhang, R. Chadda, G. M. Sessler, and M. Kupnik, “Ferroelectret-based flexible transducers A strategy for acoustic levitation and manipulation of particles”, The Journal of the Acoustical Society of America (JASA), vol. 147, no. 5, EL421–EL427, 2020. DOI: 10.1121/10.0001274 .
  • C. E. Proulx, M. Beaulac, M. David, C. Deguire, C. Haché, F. Klug, M. Kupnik, J. Higgins, and D. H. Gagnon, “Review of the effects of soft robotic gloves for activity-based rehabilitation in individuals with reduced hand function and manual dexterity following a neurological event”, Journal of Rehabilitation and Assistive Technologies Engineering, vol. 7, pp. 1–18, 2020. DOI: 10.1177/2055668320918130.
  • O. Ben Dali, P. Pondrom, G. M. Sessler, S. Zhukov, H. von Seggern, X. Zhang, and M. Kupnik, “Cantilever-based ferroelectret energy harvesting”, Applied Physics Letters, vol. 116, no. 24, p. 243 901, 2020. DOI: 10.1063/5.0006620 .
  • S. Zhukov, X. Ma, H. von Seggern, G. M. Sessler, O. Ben Dali, M. Kupnik, and X. Zhang, “Biodegradable cellular polylactic acid ferroelectrets with strong longitudinal and transverse piezoelectricity”, Applied Physics Letters, vol. 117, no. 11, p. 112 901, 2020. DOI: 10.1063/5.0023153 .
  • G. Allevato, J. Hinrichs, M. Rutsch, J. Adler, A. Jager, M. Pesavento, and M. Kupnik, “Real-time 3D imaging using an air-coupled ultrasonic phased-array”, IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, pp. 1–11, 2020. DOI: 10.1109/TUFFC.2020.3005292.
  • X. Zhang, H. von Seggern, G. M. Sessler, and M. Kupnik, “Mechanical energy harvesting with ferroelectrets”, IEEE Electrical Insulation Magazine, vol. 36, no. 6, pp. 47–58, 2020. DOI: 10.1109/MEI.2020.9222634.
  • S. Zhukov, H. von Seggern, X. Zhang, Y. Xue, O. Ben Dali, P. Pondrom, G. M. Sessler, and M. Kupnik, “Microenergy harvesters based on fluorinated ethylene propylene piezotubes”, Advanced Engineering Materials, p. 1 901 399, 2020. DOI: 10.1002/adem.201901399.
  • M. Kupnik, “Air-coupled transducer arrays: Imaging and other applications”, invited talk for IEEE International Ultrasonics Symposium (IUS), 2020.
  • G. Allevato, M. Rutsch, J. Hinrichs, M. Pesavento, and M. Kupnik, “Embedded air-coupled ultrasonic 3D sonar system with GPU acceleration”, accepted for Proc. IEEE Sensors Conference, pp. 1–4, 2020. DOI: 10.1109/SENSORS47125.2020.9278601.
  • R. Chadda, J. Probst, C. Hartmann, M. Link, M. Hessinger, E. Abele, M. Weigold, and M. Kupnik, “Disruptive force sensor based on laser-based powder-bed-fusion”, in Proc. IEEE Sensors Conference, pp. 1–4, 2020. DOI: 10.1109/SENSORS47125.2020.9278934.
  • F. Merbeler, S. Anzinger, C. Bretthauer, and M. Kupnik, “Ultra-compact clamp-on liquid level sensor based on a low-voltage CMUT”, accepted for Proc. IEEE Sensors, p. 4, 2020. DOI: 10.1109/SENSORS47125.2020.9278743.
  • J. Hinrichs, Y. Bendel, M. Rutsch, G. Allevato, M. Sachsenweger, A. Jager, and M. Kupnik, “Schlieren photography of 40 kHz leaky Lamb waves in air”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1396–1399, 2020. DOI: 10.1109/IUS46767.2020.9251532.
  • M. Krenkel, N. Lange, S. G. Koch, and M. Kupnik, “Modeling and validation of CMUTs with mechanically coupled plate actuators”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 747–750, 2020. DOI: 10.1109/IUS46767.2020.9251313.
  • M. Link, M. Weigold, J. Probst, R. Chadda, C. Hartmann, M. Hessinger, M. Kupnik, and E. Abele, “Investigation on structural integration of strain gauges using laser-based powder-bed-fusion (LPBF)”, in Proc. Production at the Leading Edge of Technology, pp. 387–395, 2020. DOI: 10.1007/978-3-662-62138-7_39.
  • R. Müller, D. Schenck, G. Allevato, M. Rutsch, J. Hinrichs, M. Kupnik, and M. Pesavento, “Dictionarybased learning for 3D-imaging with air-coupled ultrasonic phased arrays”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1536–1539, 2020. DOI: 10.1109/IUS46767.2020.9251726.
  • G. Allevato, M. Rutsch, J. Hinrichs, E. Sarradj, M. Pesavento, and M. Kupnik, “Spiral air-coupled ultrasonic phased array for high resolution 3D imaging”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 737–740, 2020. DOI: 10.1109/IUS46767.2020.9251675.
  • M. Rutsch, G. Allevato, J. Hinrichs, and M. Kupnik, “Protection layer for air-coupled waveguide ultrasonic phased arrays”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 743–746, 2020. DOI: 10.1109/IUS46767.2020.9251728.
  • J. Seiler, N. Schäfer, B. Latsch, R. Chadda, M. Hessinger, P. Beckerle, and M. Kupnik, “Wearable vibrotactile interface using phantom tactile sensation for human – robot interaction”, in Proc. International Conference on Human Haptic Sensing and Touch Enabled Computer Applications EuroHaptics 2020, pp. 380–388, 2020. DOI: 10.1007/978-3-030-58147-3_42.

2019

  • M. Krenkel, M. Stolz, S. G. Koch, and M. Kupnik, “CMUT with mechanically coupled plate actuators for low frequencies”, Journal of Micromechanics and Microengineering, vol. 29, no. 4, p. 044 001, 2019. DOI: 10.1088/1361-6439/ab035d.
  • Y. Xue, J. Zhao, X. Zhang, G. M. Sessler, and M. Kupnik, “Acoustic energy harvesting with irradiated cross-linked polypropylene piezoelectret films”, Physica Scripta, vol. 94, no. 9, p. 095 002, 2019. DOI: 10.1088/1402-4896/ab00bd.
  • M. Gaal, R. Caldeira, J. Bartusch, F. Schadow, K. Vossing, and M. Kupnik, “Air-coupled ultrasonic ferroelectret receiver with additional bias voltage”, IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 66, no. 10, pp. 1600–1605, 2019. DOI: 10.1109/TUFFC.2019.2925666.
  • J. Fauser, S. Seelecke, R. Werthschutzky, M. Kupnik, A. Mukhopadhyay, R. Chadda, Y. Goergen, M. Hessinger, P. Motzki, I. Stenin, J. Kristin, T. Klenzner, and J. Schipper, “Planning for flexible surgical robots via Bézier spline translation”, IEEE Robotics and Automation Letters, vol. 4, no. 4, pp. 3270–3277, 2019. DOI: 10.1109/LRA.2019.2926221.
  • R. Chadda, S. Wismath, M. Hessinger, N. Schafer, A. Schlaefer, and M. Kupnik, “Needle tip force sensor for medical applications”, in Proc. IEEE Sensors Conference, pp. 1–4, 2019. DOI: 10.1109/SENSORS43011.2019.8956754.
  • G. Allevato, J. Hinrichs, D. Grosskurth, M. Rutsch, J. Adler, A. Jäger, M. Pesavento, and M. Kupnik, “3D imaging method for an air-coupled 40 kHz ultrasound phased-array”, in Proc. International Congress on Acoustics, pp. 1–8, 2019.
  • O. Ben Dali, S. Zhukov, R. Chadda, P. Pondrom, X. Zhang, G. Sessler, H. von Seggern, and M. Kupnik, “Modeling of piezoelectric coupling coefficients of soft ferroelectrets for energy harvesting”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 2454–2457, 2019. DOI: 10.1109/ULTSYM.2019.8925848.
  • Y. Goergen, R. Chadda, R. Britz, D. Scholtes, N. Koev, P. Motzki, R. Werthschützky, M. Kupnik, and S. Seelecke, “Shape memory alloys in continuum and soft robotic applications”, in Proc. ASME Conference on Smart Materials, Adaptive Structures and Intelligent Systems, pp. 1–6, 2019. DOI: 10.1115/SMASIS2019-5610 .
  • F. Greiner, R. Chadda, J.-E. Adolf, S. Beck, and M. Kupnik, “Force sensor with increased local resolution for electronic contact normal force measurement in electrical connectors”, in Proc. IEEE Sensors Conference, pp. 1–4, 2019. DOI: 10.1109/SENSORS43011.2019.8956630.
  • C. Haugwitz, A. Jager, G. Allevato, J. Hinrichs, A. Unger, S. Saul, J. Brotz, B. Matyschok, P. Pelz, and M. Kupnik, “Flow metering of gases using ultrasonic phased-arrays at high velocities”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1–4, 2019. DOI: 10.1109/ULTSYM.2019.8925568.
  • A. Jager, W. M. D. Wright, M. Kupnik, J. Hinrichs, G. Allevato, M. Sachsenweger, S. Kadel, D. Stasevich, W. Gebhard, G. Hubschen, and T. Hahn-Jose, “Non-contact ultrasound with optimum electronic steering angle to excite Lamb waves in thin metal sheets for mechanical stress measurements”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 924–927, 2019. DOI: 10.1109/ULTSYM.2019.8925900.
  • F. Klug, M. Hessinger, T. Koka, P. Witulla, C. Will, T. Schlichting, C. Endl, A. Albenstetter, P.-O. Champagne, D. H. Gagnon, and M. Kupnik, “An anthropomorphic soft exosuit for hand rehabilitation”, in Proc. IEEE International Conference on Rehabilitation Robotics (ICORR), pp. 1121–1126, 2019. DOI: 10.1109/ICORR.2019.8779481 .
  • M. Krenkel, S. G. Koch, and M. Kupnik, “CMUT with mechanically coupled plate actuators – linearized electrostatic modeling”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 774–777, 2019. DOI: 10.1109/ULTSYM.2019.8925938.
  • M. Rutsch, O. B. Dali, A. Jager, G. Allevato, K. Beerstecher, J. Cardoletti, A. Radetinac, L. Alff, and M. Kupnik, “Air-coupled ultrasonic bending plate transducer with piezoelectric and electrostatic transduction element combination”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 147– 150, 2019. DOI: 10.1109/ULTSYM.2019.8925701.
  • M. Rutsch, A. Jager, A. Unger, T. Kaindl, and M. Kupnik, “Wave propagation in an acoustic waveguide for ultrasonic phased arrays”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 796–799, 2019. DOI: 10.1109/ULTSYM.2019.8926307.
  • I. Wygant, B. T. Khuri-Yakub, and M. Kupnik, “Performance parameters and frequency response of CMUTs in transmit, receive, and pulse-echo operation”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 766–769, 2019. DOI: 10.1109/ULTSYM.2019.8926031.

2018

  • C. Hatzfeld, S. Dorsch, C. Neupert and M. Kupnik, „Influence of surgical gloves on haptic perception thresholds“, The International Journal of Medical Robotics and Computer Assisted Surgery 14.1, e1852, 2018. DOI: 10.1002/rcs.1852.
  • I. O. Wygant, M. Kupnik, and B. T. Khuri-Yakub, “An analytical model for capacitive pressure transducers with circular geometry”, IEEE Journal of Microelectromechanical Systems (JMEMS), vol. 27, no. 3, pp. 448–456, 2018. DOI: 10.1109/JMEMS.2018.2823200.
  • M. Krenkel, M. Kircher, M. Kupnik and S. G. Koch, „CMUT with mechanically coupled plate actuators“, International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2018. DOI: 10.1109/EuroSimE.2018.8369874.
  • S. A. Wojcik, C. Neupert, J. Bilz, R. Werthschützky, M. Kupnik and C. Hatzfeld, „Pseudohaptic Feedback for Teleoperated Gripping Interactions“, International Conference on Human Haptic Sensing and Touch Enabled Computer Applications. Springer, Cham, 2018. DOI: 10.1007/978-3-319-93445-7_27.
  • M. Hessinger, E. Christmann, R. Werthschutzky and M. Kupnik, „User interaction measurements of an exoskeleton using EMG and joint torque“, TM-TECHNISCHES MESSEN 85.7-8, 487-495, 2018.
  • M. Hessinger, E. Christmann, R. Werthschützky, and M. Kupnik, “Messung von nutzerinteraktion mit einem exoskelett durch EMG und gelenk-drehmomente”, tm – Technisches Messen, vol. 85, no. 7-8, pp. 487–495, 2018. DOI: 10.1515/teme-2017-0133.
  • S. Park, I. Yoon, S. Lee, H. Kim, J.-W. Seo, Y. Chung, A. Unger, M. Kupnik, and H. J. Lee, “CMUT based resonant gas sensor array for VOC detection with low operating voltage”, Sensors and Actuators B: Chemical, vol. 273, pp. 1556–1563, 2018. DOI: 10.1016/j.snb.2018.07.043.
  • S. A. Wojcik, C. Neupert, J. Bilz, R. Werthschützky, M. Kupnik, and C. Hatzfeld, “Pseudohaptic feedback for teleoperated gripping interactions”, in Proc. International Conference on Human Haptic Sensing and Touch Enabled Computer Applications EuroHaptics 2018, pp. 309–320, 2018. DOI: 10.1007/978-3-319-93445-7_27.
  • M. Krenkel, M. Kircher, M. Kupnik, and S. G. Koch, “CMUT with mechanically coupled plate actuators”, in Proc. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp. 1–8, 2018. DOI:10.1109/EuroSimE.2018.8369874 .

2017

  • C. Hatzfeld, S. Dorsch, C. Neupert, and M. Kupnik, “Influence of surgical gloves on haptic perception thresholds”, The International Journal of Medical Robotics and Computer Assisted Surgery, e1852–1–9, 2017.
  • C. Hatzfeld, M. Kühner, S. Söllner, T. Khanh, and M. Kupnik, “Human Perception Measures for Product Design and Development—A Tutorial to Measurement Methods and Analysis”, MDPI Journal of Multimodal Technologies and Interaction, vol. 1, no. 28, pp. 1–23, 2017. DOI: 10.3390/mti1040028.
  • I. O.Wygant, M. Kupnik, and B. T. Khuri-Yakub, “An Analytical Model for Capacitive Pressure Transducers with Circular Geometry”, Under review for IEEE Journal of Microelectromechanical Systems, 2017.
  • S. Matich, M. Hessinger, M. Kupnik, R. Werthschützky, and C. Hatzfeld, “Miniaturized multiaxial force/torque sensor with a rollable hexapod structure”, TM – Technisches Messen, vol. 84, no. s1, 2017. DOI: 10.1515/teme-2017-0046.
  • H.-S. Yoon, S. Vaithilingam, K. K. Park, A. Nikoozadeh, K. Firouzi, J. W. Choe, R. D. Watkins, H. K. Oguz, M. Kupnik, K. B. Pauly, and P. Khuri-Yakub, “A 1-MHz 2-D CMUT array for HIFU thermal ablation”, in Proc. AIP Conference Proceedings 1821 from International Symposium on Therapeutic Ultrasound, pp. 050003–1–5, 2017. DOI: 10.1063/1.4977622 .
  • M. Gaal, R. Caldeira, J. Bartusch, and M. Kupnik, “Air-Coupled Ultrasonic Ferroelectret Receiver with Additional DC Voltage”, in Proc. Eurosensors, vol. 1, no. 4, pp. 362–1–4, 2017. DOI: 10.3390/proceedings1040362.
  • A. Jäger, D. Großkurth, M. Rutsch, A. Unger, R. Golinske, H. Wang, S. Dixon, K. Hofmann, and M. Kupnik, “Air-coupled 40-KHZ ultrasonic 2d-phased array based on a 3d-printed waveguide structure”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1–4, 2017. DOI: 10.1109/ULTSYM.2017.8091892.
  • A. Jäger, S. Johannesmann, L. Claes, M. Webersen, B. Henning, and M. Kupnik, “Evaluating the influence of 3d-printing parameters on acoustic material properties”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1–4, 2017. DOI: 10.1109/ULTSYM.2017.8092398.
  • A. Jäger, A. Unger, H. Wang, Y. Arnaudov, L. Kang, R. Su, D. Lines, S. N. Ramadas, S. Dixon, and M. Kupnik, “Ultrasonic phased array for sound drift compensation in gas flow metering”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1–4, 2017. DOI: 10.1109/ULTSYM.2017.8092174.
  • C. Hatzfeld, N. Stefanova, T. Opitz, T. Meiss, M. Degünther, J. Genzel, M. Kupnik, W. Voelker, and R. Werthschützky, “Measurement setup to evaluate haptic interaction in catheterization procedures for training purposes”, in Proc. IEEE World Haptics Conference (WHC), pp. 412–417, 2017. DOI: 10.1109/WHC.2017.7989937.
  • C. Hatzfeld, C. Neupert, S. Matich, M. Braun, J. Bilz, J. Johannink, J. Miller, P. P. Pott, H. F. Schlaak, M. Kupnik, R. Werthschützky, and A. Kirschniak, “A teleoperated platform for transanal single-port surgery: Ergonomics and workspace aspects”, in Proc. IEEE World Haptics Conference (WHC), pp. 1–6, 2017. DOI: 10.1109/WHC.2017.7989847.
  • L. Kang, A. Feeney, R. Su, D. Lines, A. Jäger, H. Wang, Y. Arnaudov, S. N. Ramadas, M. Kupnik, and S. Dixon, “Two-dimensional flexural ultrasonic phased array for flow measurement”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1–4, 2017. DOI: 10.1109/ULTSYM.2017.8092220.
  • M. Hessinger, J. Krenzer, E. Christmann, J. Hielscher, M. Kupnik, and R.Werthschützky, “Structurally Integrated Joint Torque Sensors in an Assistive Upper Limb Exoskeleton”, in Proc. International Conference on Sensors and Measurement Technology, 2017. DOI: 10.5162/sensor2017/P2.6.
  • M. Hessinger, M. Kniepkamp, J. Lotichius, C. Hatzfeld, R. Werthschützky, E. Abele, and M. Kupnik, “Strain Transmission Characteristics of Steel Substrates for Additive Sensor Manufacturing with Selective Laser Melting”, in Proc. International Conference on Sensors and Measurement Technology, 2017.
  • C. Hatzfeld, S. Schlemmer, J.-E. Adolf, Y. Gu, S. Elgner, and M. Kupnik, „Residual analysis to compare measurement series' differences with significance and size measures“, in Proc. IEEE Sensors, pp. 1-4, 2017. DOI: 10.1109/ICSENS.2017.8234004.
  • D. B. Thiem, C. Neupert, S. Matich, M. Hessinger, J. Bilz, J. Polzin, R. Werthschützky, M. Kupnik, H. F. Schlaak, A. Kirschniak, and C. Hatzfeld, “User-Interface for Teleoperation with Mixed-Signal Haptic Feedback”, in Proc. International Conference on Intelligent Robots and Systems (IROS), pp. 892–898, 2017. DOI: 10.1109/IROS.2017.8202251.
  • M. Hessinger, M. Pingsmann, R. Werthschützky, J. C. Perry, and M. Kupnik, „Hybrid position/force control of an upper-limb exoskeleton for assisted drilling“, in Proc. International Conference on Intelligent Robots and Systems (IROS), pp. 892–898, 2017. DOI: 10.1109/IROS.2017.8205997

2016

  • C. Neupert, S. Matich, N. Scherping, M. Kupnik, R. Werthschützky, and C. Hatzfeld, “Pseudo-Haptic Feedback in Teleoperation”, IEEE Transactions on Haptics, vol. 9, no. 3, pp. 397–408, 2016. DOI: 10.1109/TOH.2016.2557331.
  • C. Hatzfeld, S. Cao, M. Kupnik, and R. Werthschützky, “Vibrotactile Force Perception; Absolute and Differential Thresholds and External Influences”, IEEE Transactions on Haptics, vol. 9, no. 4, pp. 586–597, 2016. DOI: 10.1109/TOH.2016.2571694.
  • C. Hatzfeld, V. Q. Hoang, and M. Kupnik, “It’s All About the Subject – Options to Improve Psychometric Procedure Performance”, Haptics: PERCEPTION, Devices, Control, and Applications, Lecture Notes in Computer Science, pp. 394–403, 2016. DOI: 10.1007/978-3-319-42321-0_36.
  • C. Hatzfeld, J. Bilz, T. Fritzsche, and M. Kupnik, “A Reconfigurable Haptic Joystick Based on Magneto-Rheological Elastomers – System Design and First Evaluation”, in Proc. Eurohaptics: PERCEPTION, Devices, Control, and Applications, pp. 109–119, 2016. DOI: 10.1007/978-3-319-42324-1_11.
  • T. Grosse-Puppendahl, X. Dellangnol, C. Hatzfeld, B. Fu, M. Kupnik, A. Kuijper, M. R. Hastall, J. Scott, and M. Gruteser, “Platypus: Indoor Localization and Identification through Sensing of Electric Potential Changes in Human Bodies”, in Proc. Annual International Conference on Mobile Systems, Applications, and Services, pp. 17–30, 2016. DOI: 10.1145/2906388.2906402.
  • I. O. Wygant, M. Kupnik, and B. T. Khuri-Yakub, “CMUT design equations for optimizing noise figure and source pressure”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1–4, 2016. DOI: 10.1109/ULTSYM.2016.7728819.
  • F. Schiewer, H. Wang, A. Unger, N. Stefanova, and M. Kupnik, “Single-transducer acoustic levitator with equidistant vertical positioning capability”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1–4, 2016. DOI: 10.1109/ULTSYM.2016.7728813.
  • S. E. Burrows, S. N. Ramadas, T. J. R. Eriksson, L. Kang, S. M. Dixon, A. Unger, and M. Kupnik, “High temperature flexural ultrasonic transducer for non-contact measurement applications”, in Proc. Joint IEEE International Symposium on the Applications of Ferroelectrics, European Conference on Application of Polar Dielectrics, and Piezoelectric Force Microscopy Workshop (ISAF/ECAPD/PFM), pp. 1–3, 2016. DOI: 10.1109/ISAF.2016.7578077.
  • L. Kang, T. Eriksson, S. N. Ramadas, R. Su, D. Lines, M. Kupnik, and S. Dixon, “Design of flexural ultrasonic phased array for fluid-coupled applications”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1–4, 2016. DOI: 10.1109/ULTSYM.2016.7728765.

2015

  • M. Rutsch, E. Konetzke, A. Unger, M. Hoffmann, S. N. Ramadas, S. Dixon, and M. Kupnik, “Extending the receive performance of phased ultrasonic transducer arrays in air down to 40 kHz and below”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1–4, 2015. DOI: 10.1109/ULTSYM.2015.0095.
  • E. Konetzke, M. Rutsch, M. Hoffmann, A. Unger, R. Golinske, D. Killat, S. N. Ramadas, S. Dixon, and M. Kupnik, “Phased array transducer for emitting 40-kHz air-coupled ultrasound without grating lobes”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1–4, 2015. DOI: 10.1109/ULTSYM.2015.0019.
  • C. Hatzfeld, M. Kupnik, and R. Werthschützky, “Performance simulation of unforced choice paradigms in parametric psychometric procedures”, in Proc. IEEE World Haptics Conference (WHC), pp. 475–481, 2015. DOI: 10.1109/WHC.2015.7177757
  • A. Guseva, M. Hoffmann, A. Unger, S. Zulk, M. B. E. Amien, E. Sarradj, and M. Kupnik, “Ultrasonic transducer characterization in air based on an indirect acoustic radiation pressure measurement”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1–4, 2015. DOI: 10.1109/ULTSYM.2015.0333.
  • J. Lotichius, T. Singer, G. Brokmann, H. Übensee, T. Ortlepp, M. Kupnik, and R. Werthschützky, “A thermal network model for piezoresistive pressure sensors”, in Proc. IEEE SENSORS, pp. 1–4, 2015. DOI: 10.1109/ICSENS.2015.7370569.
  • C. Neupert, S. Matich, C. Hatzfeld, M. Kupnik, and R. Werthschützky, “Investigation of the usability of pseudo-haptic feedback in teleoperation”, in Proc. IEEE World Haptics Conference (WHC), pp. 488–493, 2015. DOI: 10.1109/WHC.2015.7177759.
  • R. Golinske, M. Hoffmann, E. Konetzke, A. Unger, M. Rutsch, and M. Kupnik, “Diffraction loss calculation based on boundary element method for an air-coupled phased array”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1–4, 2015. DOI: 10.1109/ULTSYM.2015.0375.
  • A. Unger, E. Konetzke, M. Rutsch, M. Hoffmann, S. N. Ramadas, S. Dixon, and M. Kupnik, “Versatile air-coupled phased array transducer for sensor applications”, in Proc. IEEE SENSORS, pp. 1–4, 2015. DOI: 10.1109/ICSENS.2015.7370187.
  • T. J. R. Eriksson, S. N. Ramadas, A. Unger, M. Hoffman, M. Kupnik, and S. M. Dixon, “Flexural transducer arrays for industrial non-contact applications”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1–4, 2015. DOI: 10.1109/ULTSYM.2015.0047.
  • J. Lotichius, S. Wagner, M. Kupnik, and R. Werthschützky, “Measurement uncertainty of time-based and voltage-based wheatstone bridge readout circuits”, in Proc. IEEE SENSORS, pp. 1–4, 2015. DOI: 10.1109/ICSENS.2015.7370386.
  • M.-C. Ho, M. Hoffmann, A. Unger, K. K. Park, M. Kupnik, and B. T. Khuri-Yakub, “CMUTs in permanent contact operation for high output pressure”, in Proc. International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, pp. 1–6, 2015. DOI: 10.1115/IPACK2015-48733.
  • M. Hoffmann, A. Unger, A. Jäger, and M. Kupnik, “Effect of transducer port cavities in invasive ultrasonic transit-time gas flowmeters”, in Proc. IEEE International Ultrasonics Symposium (IUS), pp. 1–4, 2015. DOI: 10.1109/ULTSYM.2015.0272.
  • C. Hatzfeld, C. Schröder, A. Unger, O. Morar, T. Klemm, M. Kupnik, and R. Werthschützky, “Flow sensor for field measurement of viscous liquid usage for consumer studies”, in Proc. IEEE SENSORS, pp. 1–4, 2015. DOI: 10.1109/ICSENS.2015.7370343.

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